Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of re...
| Κύριος συγγραφέας: | |
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| Συγγραφή απο Οργανισμό/Αρχή: | |
| Μορφή: | Ηλεκτρονική πηγή Ηλ. βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
Tokyo :
Springer Japan : Imprint: Springer,
2014.
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| Σειρά: | SpringerBriefs in Applied Sciences and Technology,
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| Θέματα: | |
| Διαθέσιμο Online: | Full Text via HEAL-Link |
Πίνακας περιεχομένων:
- Introduction
- On-wafer UV sensor and prediction of UV irradiation damage
- Prediction of Abnormal Etching Profiles in High-aspect-ratio Via/Hole Etching Using On-wafer Monitoring System
- Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System.
