IC Interconnect Analysis
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of the...
| Main Authors: | , , |
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| Corporate Author: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Boston, MA :
Springer US,
2002.
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| Subjects: | |
| Online Access: | Full Text via HEAL-Link |
Internet
Full Text via HEAL-LinkΒΚΠ - Πατρα: ALFd
| Call Number: |
330.01 BAU |
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| Copy 1 | Available |
ΒΚΠ - Πατρα: BSC
| Call Number: |
330.01 BAU |
|---|---|
| Copy 2 | Available |
| Copy 3 | Available |
