SpringerLink (Online service), Kuang, K., Kim, F., & Cahill, S. S. (2010). RF and Microwave Microelectronics Packaging. Springer US.
Chicago Style (17th ed.) CitationSpringerLink (Online service), Ken Kuang, Franklin Kim, and Sean S. Cahill. RF and Microwave Microelectronics Packaging. Boston, MA: Springer US, 2010.
MLA (8th ed.) CitationSpringerLink (Online service), et al. RF and Microwave Microelectronics Packaging. Springer US, 2010.
Warning: These citations may not always be 100% accurate.