Bonding in Microsystem Technology
| Main Author: | |
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| Format: | Electronic Kit Book |
| Language: | English |
| Published: |
Dordrecht
Springer
2006
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| Series: | Springer Series in Advanced Microelectronics
24 |
| Subjects: | |
| Online Access: | http://dx.doi.org/10.1007/1-4020-4589-1 |
| Physical Description: | v.: digital |
|---|---|
| ISBN: | 9781402045899 |
| ISSN: | 1437-0387 |
