Materials for Information Technology Devices, Interconnects and Packaging

Materials for Information Technology Devices, Interconnects and Packaging

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Bibliographic Details
Main Author: Zschech, Ehrenfried
Other Authors: Whelan, Caroline, Mikolajick, Thomas
Format: Electronic Kit Book
Language:English
Published: London Springer-Verlag London Limited 2005
Series:Engineering Materials and Processes
Subjects:
Engineering
Materials
Surfaces (Physics)
Electronics
Particles (Nuclear physics)
Μεταλλεύματα
Ceramics, Glass, Composites, Natural Methods
Surfaces and Interfaces, Thin Films
Electronics and Microelectronics, Instrumentation
Physics and Applied Physics in Engineering
Solid State Physics and Spectroscopy
Online Access:http://dx.doi.org/10.1007/1-84628-235-7

Internet

http://dx.doi.org/10.1007/1-84628-235-7

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